OR-MX2-AC-01 - Arctic Cooling MX-2 Thermal Paste (4g)

Density: 3.69 g/ cm3, Viscosity: 850 poise
MX-2 is a high thermal conductivity and low thermal resistance compound for components that require optimum thermal dissipation. It is ideally suited for use in CPU, GPU cooling and other applications between power semiconductor components and heat sinks where thermal conductivity is a major factor. Since the MX-2 does not contain any metal particles, there are no problems regarding electrical conductivity or capacitance. Unlike other silver and copper compounds, MX-2 ensures that contact to electrical traces, pins and leads cannot result in any damage. With MX-2 no curing and no bleeding of the compound are possible. In contrast to other products, this compound does not show decreasing performance over time, does not need to be reapplied and has a durability of at least 8 years.

Environmental
Environmental	Storage Temperature to - Storage Humidity to
Physical
Form Factor	Thermal Compound
Dimensions	(W) x (D) x (H) - Weight 0.004 kg

• High Thermal Conductivity

• Low Thermal Resistance

• Non-Electrical Conductive

• Non-Capacitive

• Non-Corrosive

• Odorless