KHX1600C9AD3K2/4G - Kingston HyperX 4GB (2x2GB) 2nd Revision Memory Kit 1600MHz DDR3 Non-ECC CL9 240-pin DIMM

DDR3 is the third generation of Double Data Rate (DDR) SDRAM memory. Similar to DDR2, it is a continuing evolution of DDR memory technology that delivers higher speeds (up to 1600 MHz), lower power consumption and heat dissipation. It is an ideal memory solution for bandwidth hungry systems equipped with dual and quad core processors and the lower power consumption is a perfect match for both server and mobile platforms. Dual In-line Memory Modules, or DIMMs, closely resemble SIMMs. Like SIMMs, most DIMMs install vertically into expansion sockets. The principal difference between the two is that on a SIMM, pins on opposite sides of the board are tied together to form one electrical contact; on a DIMM, opposing pins remain electrically isolated to form two separate contacts.
Kingston's KHX1600C9AD3K2/4G is a kit of two 256M x 64-bit (2GB) DDR3-1600MHz CL9 SDRAM (Synchronous DRAM) memory modules, based on sixteen 128M x 8-bit DDR3 FBGA components per module. Total kit capacity is 4GB. Each module kit has been tested to run at DDR3-1600MHz at a low latency timing of 9-9-9-27 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333MHz timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers and requires +1.5V.

Memory
Memory Size	4096 MB ( 2 module(s) x 2048 MB )
Memory Type	DDR3
Memory Speed	1600 MHz
Memory Package	DIMM
Pin Configuration	240 pins
Slot	240-Pin (x2) DIMM
Error Correction	Non ECC
CAS Latency	CL9
Connector Material	Gold
Module Configuration	256Mx64
Electrical
Voltage	1.65 V
Physical
Form Factor	240-Pin DIMM Module Kit
Dimensions	(W) x (D) x (H)

• JEDEC standard 1.5V ± 0.075V Power Supply

• VDDQ = 1.5V ± 0.075V

• 667MHz fCK for 1333Mb/sec/pin

• 8 independent internal bank

• Programmable CAS Latency: 5,6,7,8,9,10

• Posted CAS

• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock

• Programmable CAS Write Latency(CWL) = 7(DDR3-1333)

• 8-bit pre-fetch

• Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]

• Bi-directional Differential Data Strobe

• Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)

• On Die Termination using ODT pin

• Average Refresh Period 7.8us at lower then TCASE 85°C, 3.9us at 85°C < TCASE . 95°C

• Asynchronous Reset

• PCB : Height 1.180' (30.00mm), double sided component

Lifetime Warranty